Qualcomm Interim Engineering Intern 2026

Not Disclosed
Bangalore & Hyderabad

Engineering

Internship

Qualcomm India Private Limited has opened applications for the Interim Engineering Intern – Hardware (HW) 2026 role. This is a highly sought-after hardware engineering internship opportunity for students specializing in VLSI, Embedded Systems, ECE, and Electrical Engineering, offering hands-on exposure to cutting-edge semiconductor and SoC technologies.

The internship is available at Bangalore (Karnataka) and Hyderabad (Telangana) and is ideal for candidates aiming to build a career in chip design, SoC validation, RF/Analog design, and ASIC development.

About Qualcomm

Qualcomm is a global leader in wireless and mobile technology, widely recognized for pioneering 5G innovation. For over three decades, Qualcomm has driven advancements across industries such as automotive, healthcare, smart cities, robotics, and multimedia, powering a world where everything is connected.

Qualcomm refers to the current era as the “Invention Age”, where inventive minds collaborate to transform breakthrough ideas into real-world technologies—and this internship is a gateway to be part of that journey.

Internship Overview: Interim Engineering Intern – HW (2026)

Role Title: Interim Engineering Intern – HW
Job ID: 3078331
Job Area: Interns Group → Interim Engineering Intern (Hardware)
Internship Year: 2026
Job Posting Date: 09 December 2025

Locations

Bangalore, Karnataka, India
Hyderabad, Telangana, India

Core Technology Areas & Domains

Selected interns may work in one or more of the following advanced hardware and semiconductor domains:

SoC & Hard Macro Physical Design
SoC Validation & Debug
RF & Analog Layout
RF / Analog / Mixed Signal / Power IC Design
Low Power Design
Board Design & FPGA Design
Digital ASIC Design
Design & SoC Verification
CAD Solution Engineering
Design for Test (DFT)
CPU Design

These domains align closely with Qualcomm’s real-world product development pipelines, making the internship industry-relevant and technically intensive.

Required Technical Background & Skills

Applicants should have an educational background and hands-on exposure in one or more of the following areas:

Hardware & SoC Skills

Verification of SoCs with embedded RISC/DSP processors
Communications or networking ASICs
RTL design experience

Programming & Scripting

Verilog or VHDL
C / C++
Tcl / Perl / Shell scripting
Strong object-oriented programming (OOP) concepts

Specialized Knowledge (Role-Dependent)

Wireless / wired communication protocols
Graphics, video, or multimedia systems
RF & Analog Design knowledge:
- PLL, LNA, OpAmp
- CMOS, ADC/DAC
- Cadence tools, SpectreRF
- IC Layout

Soft Skills

Excellent analytical and problem-solving abilities
Strong collaboration and teamwork skills
Clear verbal and written communication skills

Educational Qualification

Candidates must be pursuing or have completed a degree in:

Bachelor’s or Master’s degree in:
- Electrical Engineering
- Electronics & Communication Engineering (ECE)
- VLSI
- Embedded Systems & VLSI

This role is best suited for engineering students with a strong hardware and semiconductor foundation.

Why Apply for Qualcomm HW Internship 2026?

Work with a global semiconductor leader
Exposure to real-world SoC, RF, and ASIC projects
Learn from top hardware engineers and researchers
Strengthen your profile for VLSI, chip design & core engineering roles
Be part of Qualcomm’s 5G and next-gen technology ecosystem

Equal Opportunity & Accessibility

Qualcomm is an equal opportunity employer and is committed to building an inclusive workplace. Candidates with disabilities can request reasonable accommodations during the hiring process by contacting Qualcomm HR support.

Qualcomm also follows strict policies regarding data security, confidentiality, and ethical conduct, ensuring a professional and compliant work environment.